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Reflow Equipment Product List and Ranking from 9 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Reflow Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. アントム Kanagawa//Electronic Components and Semiconductors
  2. テクノアルファ Tokyo//Electronic Components and Semiconductors
  3. ワンダーフューチャーコーポレーション Tokyo//Resin/Plastic
  4. 4 大和製作所 Saitama//Industrial Machinery
  5. 5 ダイナテックプラス Chiba//Industrial Machinery
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Reflow Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Reflow device "SOLSYS-6310IRTP" アントム
  2. Atmospheric Dedicated Furnace Reflow Device "UNI-5016F" アントム
  3. Reflow device "UNI-6116H" アントム
  4. Reflow device "SOLSYS-8310IRTP" アントム
  5. 4 VPS Reflow Device テクノアルファ

Reflow Equipment Product List

1～15 item / All 22 items

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Reflow Device "UNI-3116H"

Reflow Device "UNI-3116H"

Compact lead-free compatible furnace. Number of heating zones: 3. Device length: 780mm.

The UNI-Series is a reflow device that thoroughly pursues miniaturization, with some models having a length of 780mm while being compatible with nitrogen. Most of the delivered devices are used in clean environments. It features a heating method that combines hot air circulation and far infrared, and is a lead-free type that is energy-efficient. 【Features】 ○ 3-zone heating with 780mm N2 reflow ○ Heating method using upper hot air circulation and upper and lower far infrared ○ Ideal for cell production, development, and evaluation applications For more details, please contact us or download the catalog.

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Reflow device "UNI-6116H"

Reflow device "UNI-6116H"

Compact lead-free compatible machine. Number of heating zones: 6. Device length: 1,590mm.

The UNI-Series is a reflow device that thoroughly pursues miniaturization, with some models having a length of 780mm while still being nitrogen-compatible. Most of the delivered devices are used in clean environments. It features a heating method that combines hot air circulation and far infrared radiation, and is a lead-free type that is energy-efficient. 【Features】 ○ Combined hot air and far infrared heating from above and below ○ Maximum set temperature of 320℃ ○ Ideal not only for mass production but also for small-batch, diverse production ○ A wide range of options available to accommodate various applications For more details, please contact us or download the catalog.

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Nitrogen-Compatible Reflow Device 'SOL-6136'

Nitrogen-Compatible Reflow Device 'SOL-6136'

Compact lead-free compatible device. Number of heating zones: 6. Device length: 2,995mm.

The SOL-6136 is a medium-sized reflow oven for mass production lines that employs a heating method combining hot air circulation and far-infrared radiation from both the top and bottom. It is an energy-efficient, lead-free compatible machine that can be universally adapted for various production applications, including consumer electronics, industrial equipment, and EMS. 【Features】 - N2 reflow oven with a total length of less than 3 meters - Low oxygen concentration support of less than 100 ppm (optional) - Standard equipped with a flux recovery system For more details, please contact us or download the catalog.

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Reflow device "SOLSYS-6310IRTP"

Reflow device "SOLSYS-6310IRTP"

Compact lead-free compatible device. Number of heating zones: 6. Device length: 2,900mm.

The SOLSYS series is a medium-sized reflow oven that employs a heating method combining upper hot air circulation and upper and lower far infrared radiation. It is an effective reflow oven with a "floor heating effect" that helps suppress temperature rise in surface-mounted components. The series has added the nitrogen-compatible model SOLSYS-6250IRTP to its lineup, which has already contributed to space-saving. It is an energy-efficient, lead-free compatible model. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far infrared radiation ○ Effective "floor heating method" for suppressing temperature rise in surface-mounted components ○ Compatible with effective substrate widths up to 310mm ○ Space-saving reflow oven for mass production with a total length of less than 3m ○ Ideal not only for reflow applications but also for screening and curing applications For more details, please contact us or download the catalog.

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Reflow device "SOLSYS-8310IRTP"

Reflow device "SOLSYS-8310IRTP"

Compact lead-free compatible device. Number of heating zones: 8. Device length: 3,650mm.

The SOLSYS-Series is a medium-sized reflow oven that employs a heating method combining upper hot air circulation and upper and lower far-infrared radiation. It features a "floor heating effect" that is effective when you want to suppress the temperature rise of components on the upper side. The series has added the nitrogen-compatible model SOLSYS-6250IRTP to its lineup, which has already contributed to space-saving. It is an energy-efficient, lead-free compatible model. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far-infrared radiation ○ Effective "floor heating method" for suppressing temperature rise of upper components ○ Supports effective substrate width up to 310mm For more details, please contact us or download the catalog.

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Formic Acid Reduction Reflow Device [Case Study: Temperature Variation within the Substrate]

Formic Acid Reduction Reflow Device [Case Study: Temperature Variation within the Substrate]

Solve it with the Unitemp reflow device! Achieve rapid heating! No more worries about damage from unexpected temperatures!

Recent circuit boards are equipped with a wide variety of components, including extremely small chip components, large components, as well as module boards and BGA packages. Since each component has a different thermal capacity, by the time the temperature of the larger components rises, it may exceed the heat resistance temperature of the smaller components, potentially causing defects. If such occurrences happen frequently, it could also affect the yield. Our reflow equipment can rapidly increase the temperature on the heating plate and is designed to avoid overshoot, thereby reducing thermal stress on printed circuit boards and mounted components. Additionally, the entire heating plate is automatically controlled to maintain a uniform temperature, which helps minimize temperature variations affecting the target objects, such as circuit boards. *For more details, please refer to the PDF document or feel free to contact us.*

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[Equipment Introduction] Reflow Soldering + Nitrogen Generator

[Equipment Introduction] Reflow Soldering + Nitrogen Generator

Supports large substrates! Increases operational efficiency with a high-capacity flux recovery unit.

The "Reflow Soldering + Nitrogen Generator" is a reflow device with precise and high-quality heating performance. It has a wide substrate width range of 50×70 to 400×500 mm, making it capable of handling large substrates. 【Features】 ■ Precise and high-quality heating performance ■ Low power consumption structure ■ Large capacity, high-efficiency flux recovery ■ Insulation design considerate of the working environment *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment

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A new technology for non-contact heating implementation using electromagnetic induction: "IH Reflow Technology."

A new technology for non-contact heating implementation using electromagnetic induction: "IH Reflow Technology."

Prototyping is possible! Non-contact soldering that can mount electronic components on low heat-resistant substrates such as PET, fabric, and paper! Achieving damage-free and 100% yield mounting instantly.

"IH Reflow" is a mounting technology that applies IH (induction heating), enabling instant, non-contact mounting of only the necessary parts without physical stress, allowing for damage-free implementation. This technology makes it possible to mount electronic components that are not heat-resistant on low-heat-resistance substrates such as inexpensive, flexible, and stretchable PET, paper, and fabric. Additionally, by applying this technology, it can replace the conventional mounting processes on high-heat-dissipation substrates that typically use lasers or manual soldering, dramatically improving production throughput. Sales of IH Reflow devices, bonding experiments, prototype contracting, and unique contract mounting services based on the core technology "IH Reflow" are also available. 【Features】 - Damage-free component mounting technology for low-heat-resistance and high-heat-dissipation substrates - Heating and mounting using electromagnetic induction - Achieves instant, damage-free, non-contact mounting at specific locations with a yield of 100% - Heating method: Induction heating only at the mounting points (single point to multiple points) - Capable of mounting on low-heat-resistance substrates and high-heat-dissipation boards *For more details, please refer to the PDF materials or feel free to contact us.

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Reflow device "NRY-101V6W/LU"

Reflow device "NRY-101V6W/LU"

N2 reflow system for solder bump formation compatible with 6.8-inch wafers

The "NRY-101V6W/LU" is an N2 reflow device for bump formation after solder ball mounting or printing. The heating method combines a hot plate and an upper infrared heater. This allows for uniform temperature distribution through direct heat conduction. 【Features】 ■ Integrated loader and unloader design ■ Designed to fit the customer's magazine cassette ■ Handling into the furnace is made easy with a 3-axis clean robot, enabling inline integration with upstream equipment ■ A low-cost type that uses belt conveyor transport without a robot can also be manufactured ■ In-furnace transport is achieved through tact feeding with a walking beam (PAT.P), among other methods *For more details, please download the PDF or contact us.

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Reflow device "NRY-103V6W/LU"

Reflow device "NRY-103V6W/LU"

N2 reflow system for forming solder bumps compatible with 200-300mm wafers

The "NRY-103V6W/LU" is an N2 reflow device compatible with 200mm and 300mm printed bumps, which can also function as a wet back device after the plating bump process. The hot plate pins in the preheat zone utilize our unique liftable pins, enabling a two-stage heating temperature profile. (PAT.P) 【Features】 - Heating method combines hot plate and upper infrared heaters - The hot plate employs pin-based heating adapted to wafer warping - Excellent cleanliness within the furnace, and capable of low oxygen concentration (below 100ppm) - In-furnace transport uses our proprietary walking beam (PAT.) for tact feeding - Capable of high-precision transport with excellent cleanliness, among other features *For more details, please download the PDF or contact us.

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VPS Reflow Device

VPS Reflow Device

Achieve a stable temperature process! Capable of 3D implementation and accommodating three-dimensional structures!

At Techno Alpha, we handle the 'VPS Reflow Equipment' manufactured by IBL and R&D Vaportech. In the VPS method, products are immersed in a saturated vapor atmosphere obtained by heating a fluorinated inert heat transfer liquid (Garden), allowing the vapor that comes into contact with the product to release latent heat of vaporization and condense, enabling efficient and uniform heating of the product. This method is also effective for substrates with three-dimensional components, thick large substrates, and 3D mounting. 【Features】 ■ The vapor temperature is determined by the boiling point of the liquid used, allowing for uniform application of a constant temperature to the product. ■ Since the boiling point temperature of the liquid is utilized, the product is not exposed to temperatures above the specified temperature (= boiling point temperature), minimizing damage. ■ Because it uses vapor, it has higher thermal efficiency compared to hot air and infrared methods, improving mass production through reduced process time. *For more details, please refer to the PDF document or feel free to contact us.

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Techno Alpha's "Reflow Oven"

Techno Alpha's "Reflow Oven"

We handle a variety of reflow devices that can achieve stable temperature processes.

We would like to introduce our company's "Reflow Equipment." We handle various products, including the SST Corporation's "Vacuum and Pressure Reflow Equipment," which is suitable for process development and small-scale production of microelectronics packages, as well as the "Model 5100," which can automatically control precise heating and cooling settings, and the "VPS Reflow Equipment," which can accommodate 3D mounting and three-dimensional structures. 【Products We Handle】 ■ SST Corporation's Vacuum and Pressure Reflow Equipment ■ IBL Corporation's VPS Reflow Equipment *For more details, please refer to the PDF materials or feel free to contact us.

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Atmospheric Dedicated Furnace Reflow Device "UNI-5016F"

Atmospheric Dedicated Furnace Reflow Device "UNI-5016F"

Compact lead-free compatible machine. Suitable not only for mass production but also for cell production, evaluation, and research and development purposes!

The UNI-Series is a reflow device that thoroughly pursues miniaturization, with some models having a length of 780mm while still being compatible with nitrogen. Most of the delivered devices are used in clean environments. It features a heating method that combines hot air circulation and far-infrared radiation, and it is a lead-free type that is energy-efficient. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far-infrared radiation ○ Suitable not only for mass production but also for cell production, development, and evaluation purposes For more details, please contact us or download the catalog.

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Reflow device "SOLSYS-8460IRTP"

Reflow device "SOLSYS-8460IRTP"

Compact lead-free compatible machine. Number of heating zones: 8. Equipment length: 3,650mm.

The SOLSYS-Series is a medium-sized reflow oven that employs a heating method using upper hot air circulation combined with upper and lower far-infrared radiation. It is an effective reflow oven with a "floor heating effect" that helps suppress the temperature rise of components on the upper side. The series has added the nitrogen-compatible model SOLSYS-6250IRTP to its lineup, contributing to space-saving solutions. It is an energy-efficient, lead-free compatible model. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far-infrared radiation ○ Effective "floor heating method" for suppressing temperature rise of upper components ○ Compatible with a substrate effective width of up to 460mm For more details, please contact us or download the catalog.

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Nitrogen-Compatible Reflow Device 'SOL-6125'

Nitrogen-Compatible Reflow Device 'SOL-6125'

Compact lead-free compatible machine. Number of heating zones: 6. Equipment length: 3,250mm.

The SOL-6125 is a medium-sized reflow oven that employs a heating method using upper hot air circulation and upper and lower far infrared rays. It is an effective reflow oven with a "floor heating effect" that helps suppress the temperature rise of components on the upper side. It is an energy-saving, lead-free compatible model. 【Features】 ○ Ideal nitrogen-compatible furnace for space-saving mass production ○ Heating method using upper hot air circulation and upper and lower far infrared rays ○ Effective "floor heating method" for suppressing temperature rise of upper components ○ Standard equipped with an easy maintenance flux recovery system ○ Supports effective substrate width up to 250mm For more details, please contact us or download the catalog.

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